2018-05-21 Henkel Thermal Management, Interconnect and Protection Materials on Show at SMT Hybrid Packaging 2018 Live demonstrations of encapsulating, heat dissipating hot melt material Read More
Thermal-Clad/Isolated Metal Substrate Thermal Management System Effective thermal management is key to ensuring consistent performance and long-term reliability of many electronic devices. Consumer demand for smaller, higher functioning devices presents even greater challenges for thermal management, as these conditions produce higher temperatures and more stress for electronic components. To ensure effective heat management for semiconductor devices, Henkel has developed the Thermal-Clad/Insulated Metal Substrate, which offers a highly-efficient method to cool these devices. Thermal-Clad insulated substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed circuit boards. This information will be presented during the upcoming Henkel webinar, along with details about selection of the application-specific dielectric. Henkel will explore in this webinar what alternate solution engineers can chose and which dielectric selection is the best for the application. Author: Michael Stoll... Read More
Thermally Conductive "cure in place" Gap Filler as an Optimal Thermal Materials Solution for Highly Effective Cooling of Electronics Effective thermal management is key to ensuring consistent performance and long-term reliability of many electronic devices. With the wide variety of applications requiring thermal management, the need for alternative thermal material solutions and innovative material placement methods continues to grow. In response, Bergquist and Henkel have developed and supply a variety of highly efficient, flexible and easy to handle thermally conductive interface materials to meet current and future needs for effectively cooling electronic systems ensuring long-term reliability. One of those materials are Polymer-based dispensable Gap Fillers with unique characteristics especially designed for ultimate thermal management design and component assembly flexibility. Thermally conductive cure-in-place liquid Gap Fillers are an alternate to classical Pads that dispense efficiently, have high thermal performance as well as can be fully automated in processing. Author: Holger Schuh Read More
Thermal Interface Materials - Novel Solutions for Power Electronics and Heat Management in Handheld Devices As power electronic devices become more and more prevalent in different markets, the need for new materials to enable higher performance — while maintaining reliability — is gaining higher focus. The management of heat for these upcoming applications requires new designs and technologies. Author: Giuseppe Caramella Read More