BERGQUIST® GAP PAD® TGP HC5000

Known as Gap Pad® HC 5.0

Features and Benefits

Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
  • Silicone-based
  • Fiberglass-reinforced for shear and tear resistance
  • Thermal conductivity: 5 W/m-K (ASTM D5470)
  • High compliance, low compression stress
Read More

Technical Information

Carrier type Fiberglass
Flame rating V-0
Operating temperature -60.0 - 200.0 °C
Thermal conductivity 5.0 W/mK
Young's modulus, ASTM D575 121.0 KPa (17.5 psi )