BERGQUIST® GAP PAD® TGP HC5000

Bekannt als Gap Pad® HC 5.0

Merkmale und Vorteile

Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Dokumente und Downloads

Sicherheit Datenblätter und RoHs
BERGQUIST® GAP PAD® TGP HC5000, 8″x16″ Abmessung, 0.100" Dicke 2168237 de-DE
IDH: 2168237

Verpackungsgröße: Blatt

Anzahl: 1.0/Box

BERGQUIST® GAP PAD® TGP HC5000, 8″x16″ Abmessung, 0.020" Dicke 2195376 de-DE
IDH: 2195376

Anzahl: 1.0/Box

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BERGQUIST® GAP PAD® TGP HC5000, 8″x16″ Abmessung, 0.040" Dicke 2195377 de-DE
IDH: 2195377

Anzahl: 1.0/Box

SDS herunterladen

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Technische Informationen

Betriebstemperatur -60.0 - 200.0 °C
Elastizitätsmodul, ASTM D575 121.0 KPa (17.5 psi )
Entflammbarkeit V-0
Träger Glasfaser
Wärmeleitfähigkeit 5.0 W/mK

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