BERGQUIST® SIL PAD® TSP K1100
Conocido como Sil-Pad® K-6
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BERGQUIST SIL PAD TSP K1100, Thermally Conductive, The Medium Performance Polyimide-Based Insulator
BERGQUIST® SIL PAD® TSP K1100 is a medium performance, film-based thermally conductive insulator. The film is coated with a silicone elastomer to deliver high performance and provide a continuous, physically strong dielectric barrier against “cut-through” and resultant assembly failures.Options and ConfigurationsConfiguration - 12" x 12" sheets, 12" x 250 rolls or custom configurationAdhesive - Adhesive one side, no adhesiveStandard thickness - 0.006"Custom made configurations available upon request
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Información técnica
| Conductividad térmica | 1.1 W/mK |
| Constante dieléctrica, @ 1kHz | 4.0 |
| Dureza Shore, ASTM D2240 Shore A | 90.0 |
| Espesor | 0.152 mm |
| Impedancia térmica, ASTM D5470 @ 50 psi | 0.49 °C-in²/W |
| Resistencia a la flama | V-0 |
| Resistividad de volumen | 1×10 Ohm m |
| Temperatura de funcionamiento | -60.0 - 180.0 °C |
| Tensión de ruptura dieléctrica | 6000.0 Vac |
BERGQUIST® SIL PAD® TSP K1100
BERGQUIST SIL PAD TSP K1100, Thermally Conductive, The Medium Performance Polyimide-Based Insulator