LOCTITE® ABLESTIK 8008MD

Known as ABLECOAT 8008MD

Features and Benefits

LOCTITE ABLESTIK 8008MD, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 8008MD adhesive is designed for medium die attach applications. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process. This material was originally released as RP-825-3C1.
  • Electrically conductive
  • Thermally conductive
  • Low modulus
  • Good substrate wetting
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Technical Information

Applications Die attach
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 9.0 ppm
Extractable ionic content, Potassium (K+) 9.0 ppm
Extractable ionic content, Sodium (Na+) 9.0 ppm
Hot die shear strength 2.7 kg-f
Storage temperature -40.0 °C
Tensile modulus, DMTA @ 250.0 °C 440.0 N/mm² (63820.0 psi )