LOCTITE® ABLESTIK 2200D

Features and Benefits

LOCTITE ABLESTIK 2200D, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 2200D electrically conductive die attach adhesive is designed for high reliability leadframe packaging applications.
  • Low stress
  • Excellent hot/wet adhesion to metal leadframes
  • Low moisture absorption
  • Snap curable
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 62.0 ppm/°C
Cure type Heat cure
Hot die shear strength 6.3 kg-f
RT die shear strength 12.7 kg-f
Tensile modulus, @ 250.0 °C 83.0 N/mm² (12000.0 psi )