Electronics
Improving the electronics technologies of today, for the advances of tomorrow
Electronics innovation touches nearly every facet of our lives. We drive hybrid and electric vehicles with advanced driver assistance systems, use smartphones to manage our work and play, see a new world through augmented reality (AR) headsets, enjoy personalized on-screen entertainment while flying in airplanes, and control our living space through connected home devices. Years ago, some of these innovations were only a dream.
Henkel is the premier materials supplier for the electronics assembly and semiconductor packaging industries. Our advanced formulations include a range of products that facilitate electrical interconnect, provide structural integrity, offer critical protection, and transfer heat for reliable performance. We're proud to create products that improve today’s electronic technologies and enable tomorrow’s advances.
Because of the breadth of our materials portfolio, the depth of our application expertise, and the unmatched scope of our global capabilities, the world’s top technology companies - electronics innovators - choose to partner with us.
No matter your challenge, we can help you find a reliable, cost-effective solution, and support you throughout the entire life cycle of your project with a global sales and technical customer service team.
Henkel Adhesives Solutions for Electronics
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Insulated Metal Substrate (IMS)
Minimizes thermal impedance and conducts heat more effectively for higher watt-density surface mount applications.
THERMAL CLAD Insulated Metal Substrates (IMS®)
Surface Mount Adhesives
Ideal for high-speed assembly processes, low-temperature processing, screen printing deposition and automatic dispensing for high-throughput and maximum process flexibility.
Thermal Management
Solder Materials
High reliability alloys with halogen-free, halide-free chemistries for water-wash and no-clean tin-lead and lead-free manufacturing processes.
Solder Materials
Gasketing
Eliminates corrosion and provides an instant, low-pressure seal on an assembly after full cure; will not shrink, crack or relax, and resists displacement.
Gasket Sealants
Electrically Conductive Adhesives
Highly conductive sliver-filled ECAs used as a solder alternative, with low temperature curing for high temp environments where solder may not be suitable.
Conductive Adhesives
Conformal Coatings
Safeguards PCB with acrylic, Polyurethane, urethane or silicone conformal coatings against adverse environmental conditions.
Conformal Coating
Liquid Gap Filler
Offering excellent thermal and mechanical performance – as a replacement for grease, potting compounds, or pads – for intricate and multilevel surfaces.
Gap Filler, EMI Shielding
Thermally Conductive Adhesives
Adhesives with thermal fillers like silver or aluminum oxide that offer superior heat dissipation for a wide range of electronic applications, available in silicone, epoxy and hybrid BMI chemistries, which are hydrophobic.
Thermal Conductive Adhesive
Non-Conductive Paste
Pre-applied semiconductor underfill, facilitating bump protection and interconnection in a single step. offering excellent bump reinforcement and safeguarding for fine pitch devices.
Non-Conductive Paste
Potting Compound
A permanent protective solution providing reliable shielding and adhesion against environmental influences, improving mechanical strength and providing high electrical insulation for PCBs.
Sealants
Used to seal surfaces in order to prevent passage of liquids or gas.
Sealants
Low Pressure Molding
Providing electrical insulation and temperature, vibration and solvent resistance for modern PCB and circuitry protection against high humidity, long-term UV exposure and thermal cycling.
Low Pressure Molding
Thermally Conductive Adhesives
Customizable liquid, tapes, pads, or mix for the mechanical attachment of components to a heat sink with thermal transfer properties and without the need for additional fasteners.
Thermally Conductive Adhesives
Electrically Insulating Film Adhesives
Dielectric films and tapes offer conformability, easy application, and reliable tack designed to perform at high temperatures and resist oxidation, solvents, and oils while maintaining physical and electrical integrity.
Film Adhesives
CSP Underfills (Cornerbond)
Offering reworkable and non-reworkable formulations that lower stress, improve reliability, offer room temperature flowability, and effectively fill bottom-side components spaces with low bump heights.
Board-Level Underfill
Inks for Printed Electronics
Offering specialized and cross-functional silver, carbon, dielectric, and clear conductive inks for fine-line printing and the miniaturized dimensions of modern-day electronics.
Printed Inks & Coatings, Medical
Phase Change (HI-FLOW) Materials and Greases
Offer outstanding thermal impedance between heat dissipating devices and their opposing assembly surfaces, available in printable, dispensable and film formats. performance.
Phase Change
Glob Top & Encapsulants
Superior protection for electronic components attached to circuit boards. Chip-on-board components are shielded from environmental stresses, contamination, and mechanical vibration. Available in silicones, epoxies and hybrid chemistries.
Glob Top & Encapsulants
Electrically Conductive Film Adhesives
Available in sheets, and precut to specific shapes and sizes, offer great thermal and electrical properties for bonding circuit boards to metal frames and heat sinks.
Conductive Die Attach (CDAF) Film
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