LOCTITE® ABLESTIK 958-11
Known as ABLESTIK ABLEBOND 958-11
Features and Benefits
LOCTITE ABLESTIK 958-11, Epoxy, Die attach
LOCTITE® ABLESTIK 958-11 adhesive is designed to absorb stresses produced when bonding large ICs.
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Documents and Downloads
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Technical Information
| Applications | Die attach |
| Cure schedule, @ 130.0 °C | 2.0 hr. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Shear strength, Aluminum | 2700.0 psi |
| Storage temperature | -40.0 °C |
| Viscosity, @ 25.0 °C | 45000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 958-11
LOCTITE ABLESTIK 958-11, Epoxy, Die attach