BERGQUIST® GAP PAD® TGP 3500ULM

Known as Gap Pad® 3500ULM

Features and Benefits

A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
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Technical Information

Carrier type Fiberglass, Non-fiberglass
Color Gray
Flame rating V-0
Operating temperature -60.0 - 200.0 °C
Standard thickness 0.508 - 3.175 mm
Thermal conductivity 3.5 W/mK
Young's modulus 27.5 KPa (4.0 psi )