LOCTITE® ABLESTIK QMI529HT-LV
Caractéristiques et avantages
This thermally and electrically conductive die attach adhesive is designed for use in high throughput applications. It is hydrophobic and stable at high temperatures.
As the market leader and top innovator of the most advanced die attach solutions, LOCTITE® ABLESTIK® adhesives deliver superior die packaging reliability performance – and LOCTITE® ABLESTIK QMI529HT-LV is no exception. Specially designed for use in high throughput applications, this product is hydrophobic with low moisture absorption, thermally and electrically conductive, and stable at high temperatures. You can also expect great dispensing characteristics. LOCTITE® ABLESTIK QMI529HT-LV passes NASA outgassing and MIL-STD-883 standards, Method 5011.
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Informations techniques
Applications | Soudage de puce |
Coefficient de dilatation thermique (CDT) | 62.0 ppm/°C |
Module d'élasticité, @ 250.0 °C | 738.0 N/mm² (107037.0 psi ) |
Résistance au cisaillement puce RT | 20.0 kg-f |
Résistance au cisaillement puce chaude | 3.75 kg-f |
Teneur ionique extractible, Chlorure (Cl) | 9.0 ppm |
Teneur ionique extractible, Fluorure (F) | 9.0 ppm |
Teneur ionique extractible, Potassium (K+) | 9.0 ppm |
Teneur ionique extractible, Sodium (Na+) | 9.0 ppm |
Type de polymérisation | Polymérisation par la chaleur |