LOCTITE® ABLESTIK ABP 8415

Features and Benefits

LOCTITE ABLESTIK ABP 8415, Epoxy, Die attach
LOCTITE® ABLESTIK ABP 8415 adhesive is designed for die attach applications.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 60.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 210.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) 35.0 °C
Thixotropic index 3.25
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 16000.0 mPa·s (cP)