LOCTITE® ABLESTIK 2332-17
Features and Benefits
This 1-part, black epoxy adhesive for assembly applications bonds to a wide array of substrates, such as copper, aluminium, and nickel.
LOCTITE® ABLESTIK 2332-17 is a solvent-free epoxy adhesive for assembly bonding. It bonds to a wide variety of surfaces, including copper, aluminium, nickel, FRP, rigid plastics, and oily steel. The product develops high bond strength when cured at temperatures as low as 100°C to 130°C (212°F to 266°F). It combines flexibility at low temperatures with high peel- and tensile shear strength over a broad temperature range.
- 1-part: no mixing required
- Solvent-free
- Multi-substrate
Documents and Downloads
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Technical Information
| Cure schedule, Recommended @ 120.0 °C | 1.0 hr. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Operating temperature | 150.0 °C |
| Recommended for use with | Fiberglass reinforced plastic (FRP) |
| Shear strength, Aluminium | 1740.0 psi |
| Storage temperature | 0.0 - 8.0 °C |
| Viscosity, @ 25.0 °C | 75000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2332-17
This 1-part, black epoxy adhesive for assembly applications bonds to a wide array of substrates, such as copper, aluminium, and nickel.