Bergquist SIL PAD® thermally conductive insulators are designed to be clean, grease-free and flexible. The combination of a tough carrier material, such as conformable fiberglass and silicone rubber, provides a more versatile material than mica or ceramics and grease. SIL PAD® thermal conductivity products minimize thermal resistance from the external package of a power semiconductor to the heat sink, electrically isolating the semiconductor from the heat sink and providing sufficient dielectric strength to withstand high voltage. They are also strong enough to resist puncture from the facing metal surface. Supplied on rolls, Bergquist SIL PAD® materials are also applicable to a fully automated pick-and-place process.
SIL PAD® - Solutions-Driven Thermal Management
Q-PAD® - Non-electrically Conductive Thermal Protection
Bergquist SIL PAD® TSP Q type materials are a composite of aluminum foil-or glassweave reinforced - coated on both sides with thermally and electrically conductive SIL PAD® rubber. The materials are designed for those applications where maximum heat transfer is needed and electrical isolation is not required. Bergquist SIL PAD® TSP Q type products are the ideal thermal interface material to replace messy thermal grease compounds.
Applications and Industries
Henkel’s SIL PAD® & Q-PAD® product portfolios can be used for both industrial and consumer applications in the following industries: