LOCTITE® ECCOBOND NCP 5209
Features and Benefits
This yellow non-conductive die-attach adhesive is designed for thermal compression bonding processes in flip chip to laminate assembly.
LOCTITE® ECCOBOND NCP 5209 is a pale yellow, acrylate-based, non-conductive die-attach adhesive for advanced flip chip Cu pillar applications. It leverages thermal compression bonding for robust bump protection. It is compatible with small assembly gaps and tight pitches and is typically used as a pre-applied underfill to provide optimal fluxing activity for good solder joint formation. Cures fast when exposed to heat.
- Low ionic impurities
- Fast curing
- Non-conductive
- Offers excellent protection of electrical joints
Documents and Downloads
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 80.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 28.0 ppm/°C |
| Extractable ionic content, Chloride (CI-) | 10.0 ppm |
| Extractable ionic content, Potassium (K+) | 10.0 ppm |
| Extractable ionic content, Sodium (Na+) | 10.0 ppm |
| Glass transition temperature (Tg) | 145.0 °C |
| Storage modulus, DMA @ 25.0 °C | 7.3 GPa (7300.0 N/mm² , 1058775.0 psi ) |
| Storage temperature | -40.0 °C |
| Viscosity, @ 25.0 °C Spindle 51, speed 5 rpm | 12500.0 mPa·s (cP) |
LOCTITE® ECCOBOND NCP 5209
This yellow non-conductive die-attach adhesive is designed for thermal compression bonding processes in flip chip to laminate assembly.