LOCTITE® ECCOBOND EN 3707F
Features and Benefits
LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant
LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
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Technical Information
| Applications | Encapsulating |
| Coefficient of thermal expansion (CTE), Above Tg | 162.2 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 50.3 ppm/°C |
| Color | Light Blue |
| Cure schedule light intensity | 100.0 mW/cm² |
| Cure schedule, @ 100.0 °C | 5.0 min. |
| Cure schedule, @ 130.0 °C | 1.0 - 2.0 min. |
| Cure schedule, @ 80.0 °C | 30.0 min. |
| Cure type | UV Cure |
| Depth of cure | 10.0 mm |
| Glass transition temperature (Tg) | 37.0 °C |
| Shelf life | 180.0 day |
| Shore hardness, Shore D | 27.0 |
| Storage modulus, DMA @ 25.0 °C | 4400.0 N/mm² (638000.0 psi ) |
| Storage temperature | -20.0 °C |
| Thixotropic index | 4.1 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm | 3480.0 mPa·s (cP) |
LOCTITE® ECCOBOND EN 3707F
LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant