BERGQUIST® GAP PAD® TGP 1500
Poznano kot Gap Pad® 1500
Lastnosti in prednosti
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.
BERGQUIST® GAP PAD TGP 1500 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness, and is conformable and electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with ease of handling.
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Tehnične informacije
| Barva | Črna |
| Delovna temperatura | -60.0 - 200.0 °C |
| Standardna debelina | 0.508 - 5.08 mm |
| Toplotna prevodnost | 1.5 W/mK |
| Youngovi moduli, ASTM D575 | 310.0 KPa (45.0 psi ) |
BERGQUIST® GAP PAD® TGP 1500
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.5W/mK.