LOCTITE® ECCOBOND FP4470
Features and Benefits
LOCTITE ECCOBOND FP4470, Epoxy, Encapsulant
LOCTITE® ECCOBOND FP4470 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC Level 2A (60°C/60% RH, 120 hours) preconditioning. LOCTITE ECCOBOND FP4470 is a high adhesion version of FP4450 for 260°C L3 JEDEC performance.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 65.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 18.0 ppm/°C |
| Color | Black |
| Cure schedule, Alternate @ 165.0 °C | 90.0 min. |
| Cure schedule, Recommended @ 125.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Dielectric constant, @ 1kHz | 3.5 |
| Glass transition temperature (Tg) | 148.0 °C |
| Operating temperature | -65.0 - 150.0 °C |
| Specific gravity, @ 25.0 °C | 1.8 |
| Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 6, speed 10 rpm | 42000.0 mPa·s (cP) |
| Volume resistivity | 5x10¹⁶ Ohm cm |
LOCTITE® ECCOBOND FP4470
LOCTITE ECCOBOND FP4470, Epoxy, Encapsulant