BERGQUIST® GAP PAD® TGP HC3000
Žinoma kaip Gap Pad® HC 3.0
Savybės ir privalumai
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.
BERGQUIST® GAP PAD TGP HC3000 is designed with a unique filler package and low modulus material to provide exceptional thermal performance at low pressures. The highly conforming material provides excellent wet-out characteristics at the interface of rough and irregular surfaces and is ideal for fragile applications that require low stress on components and boards during assembly.
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Dokumentai ir atsisiuntimai
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Techniniai duomenys
| Darbinė temperatūra | -60.0 - 200.0 °C |
| Liepsnos įvertinimas | V-0 |
| Nešančiosios medžiagos tipas | Stiklo pluoštas |
| Spalva | Mėlyna |
| Standartinis storis | 0.508 - 3.175 mm |
| Šilumos laidumas | 3.0 W/mK |
| „Young“ modulis, ASTM D575 | 110.0 KPa (16.0 psi ) |
BERGQUIST® GAP PAD® TGP HC3000
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K.