TECHNOMELT® low pressure molding material solutions from Henkel offer streamlined processing and excellent protection for modern connectors, electronic components, printed circuit boards (PCBs), and lighting applications. The simplicity of these products is their advantage: the entire TECHNOMELT® operation takes place at low pressure, cycle time is short, and fine or fragile circuitry is not damaged. For these reasons, TECHNOMELT® is increasingly being chosen as an alternative to potting and encapsulating processes.

Whether you are looking for polyamide or polyolefin hot melt adhesives, TECHNOMELT® materials deliver exceptional electrical insulation, as well as temperature, vibration, and solvent resistance for many applications. The broad product range protects electronics from the harshest environmental conditions, including high humidity, long-term UV exposure, and extreme thermal cycling. Henkel’s TECHNOMELT® is a trusted supplier of high-quality low pressure molding materials that help protect electronic circuit boards and other components against various environmental pressures.

Contact us today to talk to our team of experts about our entire line of low pressure molding materials.

Low Pressure Molding Materials

TECHNOMELT® low pressure molding materials are specially designed for PCB protection while helping you cut cost and improve quality across different applications. Our low pressure molding compounds include thermoplastic polyamides and polyolefin hot melt adhesives suitable for different low pressure molding systems. Low pressure molding is a faster and more efficient process than conventional potting. TECHNOMELT® is a one-part material that requires no mixing or curing and, therefore, reduces material consumption through streamlined, multi-level, and contour-exact encapsulation. This also constitutes a sustainable solution through its unique re-usable formulation and green chemistry. Integrating TECHNOMELT® low pressure molding compounds as an alternative to potting also reduces part numbers by eliminating the need for housing or additional parts to achieve strain relief.

As electronic device manufacturers continue to move toward more cost-effective and sustainable solutions, TECHNOMELT® integration for viable protection of electronic components and systems is accelerating. Today, TECHNOMELT® is used in a wide range of applications, such as the recent lighting enhancement on a bridge in a major US city, where TECHNOMELT® was used to encase 25,000 LED circuit boards, protecting the sensitive LED electronics from the harsh geographic environment.

TECHNOMELT® also was chosen to protect electronic controllers in the robot that capped a ruptured pipe in an infamous oil spill in the Gulf of Mexico. TECHNOMELT® can be found in these high-visibility applications, as well as in products like coffee makers, self-driving cars, GPS tracking devices, and PC accessories. Find out more about the different industries and applications that use low pressure molding compounds:

 

The Benefits of our Low Pressure Molding Systems

Simplified Manufacturing Process 

Part of TECHNOMELT®’s appeal is its ease of processing. Whereas conventional potting can involve as many as eight or more distinct steps and take as long as 24 hours to complete, the low pressure molding process can be achieved in as little as 30 seconds. 

Hot melt polyamides granules are poured into the melt tank which is attached to the low pressure molding equipment. After heating to between 180°C and 210°C, the liquidus material is injected into a pre-designed mold set which contains the electronic device. Low pressure and heat are applied, after which the electronics are fully encapsulated and can be handled and tested. TECHNOMELT® materials can even be processed on certain plastic injection machines with extruder.

Sustainability


 
  • Zero waste
  • Natural ingredients based largely on vegetable oils
  • No harmful fumes from molding process
  • Long shelf life
  • RoHS and REACH compliant

Material Compatibility


 
  • Lightweight material
  • Excellent adhesion to multiple surfaces
  • Watertight encapsulation
  • High temperature, shock, environmental and solvent resistance
  • No cure process required
  • No fillers, so mold sets can be made out of less expensive aluminum and still be durable
  • Safe, 1-component, many hotmelts are UL 94-V0 approved
  • Compliant materials suitable for sensitive electronic components

Cost Savings

 
  • Fewer physical parts, reducing the number of items on the bill of materials (BOM)
  • Reduced shipping costs of final products
  • Reduced total cost of ownership (TCOO)
  • Increased throughput
  • Low capital equipment costs
  • Reduce production space
  • Reduced inventory and work-in-process (WIP)
  • Lower labor cost per part

The TECHNOMELT® Low Pressure Molding Process

How does low pressure molding with TECHNOMELT® work? It's really simple, because you are able to encapsulate your electronic products in only three steps:

  1. Insert bare electronics into your predesigned mold set
  2. TECHNOMELT® encapsulates electronics at low pressure and temperatures
  3. Test parts and move them to final assembly — immediately after molding

Do you have questions about the TECHNOMELT® line of low pressure molding materials? Contact a member of a team today and we will be happy to assist you. We offer specialized services for all low pressure molding systems and our team of experts are able to assist you with all your questions.

Low Pressure Molding Technology for Cables and Connectors

If you are looking for low pressure molding solutions for cables and connections, look no further than TECHNOMELT® low pressure molding materials. Watch the video below to find out more.

To find out more about our polyamide and polyolefin hot melt adhesives, click here.

Further Information

To find out more about our low pressure molding materials, download the following PDFs.

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