Electronic components need to be protected against moisture, chemical exposure and high temperatures, but standard production cycles with bonding and encapsulation takes time and have design limitation. 

TECHNOMELT® and LOCTITE® low pressure molding material solutions from Henkel offer streamlined processing and excellent protection for Medical, Electronic Components, Power & Industrial Automation, HVAC and Lighting applications.LOCTITE® low pressure molding materials have been tested to Henkel’s protocols based upon ISO-10993 biocompatibility standards, with certificates available on request. The simplicity of these products is their advantage: the entire Henkel operation takes place at low pressure, cycle time is short, and fine or fragile circuitry is not damaged. For these reasons, TECHNOMELT® and LOCTITE® are increasingly being chosen as an alternatives to encapsulating processes (e.g. potting) as well as conventional plastic housings.

Whether you are looking for polyamide or polyolefin hot melt adhesives, Henkel materials deliver exceptional electrical insulation, as well as temperature, vibration, and solvent resistance for modern connectors, electronic components, printed circuit boards (PCBs), lighting and medical applications. The broad product range protects electronics from the harshest environmental conditions, including high humidity, long-term UV exposure, and extreme thermal cycling. Henkel is a trusted supplier of high-quality low pressure molding materials that help protect electronic circuit boards and other components against various environmental pressures.

Contact us today to talk to our team of experts about our entire line of low pressure molding materials.

Examples of Low Pressure Molding

Cable and Connectors

If you are looking for low pressure molding solutions for cables and connections, look no further than TECHNOMELT® low pressure molding materials. Watch the video below to find out more.

To find out more about our polyamide and polyolefin hot melt adhesives, click here.

Medical Application 

To get an impression how low pressure molding solutions can protect your electronics for medical applications. Have a look at the video below to find out more.

Low Pressure Molding Technology for Medical Applications. LOCTITE® with low pressure molding helped to protect wearable pulse oximeters . To find out more about our polyamide and polyolefin hot melt adhesive, click here

The TECHNOMELT® and LOCTITE® Low Pressure Molding Process

How does low pressure molding with TECHNOMELT® and LOCTITE® materials work? It's really simple, because you are able to encapsulate your electronic products in only three steps:

  1. Insert bare electronics into your predesigned mold set
  2. Henkel encapsulates electronics at low pressure and temperatures
  3. Test parts and move them to final assembly — immediately after molding

Do you have questions about the Henkel line of low pressure molding materials? Contact a member of a team today and we will be happy to assist you. We offer specialized services for all low pressure molding systems and our team of experts are able to assist you with all your questions.

How does low pressure molding fit to traditional manufacturing methods, such as injection molding and potting? It is similar to plastic injection molding but operating at a lower pressure, which makes this manufacturing method perfect for electronic components. Compared to Potting, low pressure molding reduces manufacturing times significantly and less cleaning requirements are needed. 

Low Pressure Molding Materials

Henkel low pressure molding materials are specially designed for PCB protection while helping you cut cost and improve quality across different applications. Our low pressure molding compounds include thermoplastic polyamides and polyolefin hot melt adhesives suitable for different low pressure molding systems. Low pressure molding is a faster and more efficient process than conventional potting. Henkel is a one-part material that requires no mixing or curing and, therefore, reduces material consumption through streamlined, multi-level, and contour-exact encapsulation. This also constitutes a sustainable solution through its unique re-usable formulation and green chemistry. Integrating Henkel low pressure molding compounds as an alternative to potting also reduces part numbers by eliminating the need for housing or additional parts to achieve strain relief.

 

TECHNOMELT® and  LOCTITE® LPM Material Overview

Standard

Excellent Adhesion

Increased
Hardness

Clear

Thermally
Conductive

PA 633 N

PA 673 N

PA 652 N

PA 6211

PA 673 N

PA 668 N

PA 6773 GREY

PA 638 BLACK

PA 678 BLACK

PA 657 BLACK

PA 6240

PA 678

PA 6900

 

PA 641

PA 2035 AMBER & BLACK

PA 653

PA 6797

PA 2302 BLACK

 

 

PA 646 BLACK

 

PA 658 BLACK

AS 5376

PA 2035 AMBER & BLACK

 

 

PA 652 N

 

PA 6208 N AMBER & BLACK

 

PA 6300

   

PA 657 BLACK

     

AS 292*

   

*Available in selected regions

 

TECHNOMELT® and LOCTITE® LPM Material Overview

Special Resistance

Cold Flexibility

High Temperature Resistant

Solvent
Resistant

UV Resistant

Hydrolysis
Resistant

Medical Grade

PA 652 N

PA 676

PA 673 N

PA 2302

PA 2384

PA 6344 BLACK

PA 653

PA 6951** TRANSLUCENT WHITE

PA 657 BLACK

PA 6771 BLACK

PA 678 BLACK

PA 2035 AMBER & BLACK

AS 5376

PA 6771 BLACK

PA 658 BLACK

PA6732**

AMBER

PA 653

PA 6782 BLACK

PA 676 BLACK*

PA 2692

AS 292

PA 6481 BLACK

PA 6771 BLACK

PA6682**

CLEAR

PA 658 BLACK

 

PA 687 BLACK

 

 

PA 668 WHITE*

 

 

*Available in selected regions
**ISO 10993

Looking for a TDS or SDS in another language?
 

The Benefits of TECHNOMELT® and LOCTITE® low pressure molding

Success stories with TECHNOMELT® and LOCTITE® low pressure molding

As electronic device manufacturers continue to move toward more cost-effective and sustainable solutions, TECHNOMELT® integration for viable protection of electronic components and systems is accelerating. Today, Henkel low pressure materials are used in a wide range of applications as for plugs and connectors, cable bunding, control units, monitors, sensors and many more. One example of where TECHNOMELT® was used is the recent lighting enhancement on a bridge in a major US city. TECHNOMELT® was used to encase 25,000 LED circuit boards, protecting the sensitive LED electronics from the harsh geographic environment.

TECHNOMELT® also was chosen to protect electronic controllers in the robot that capped a ruptured pipe in an infamous oil spill in the Gulf of Mexico. TECHNOMELT® can be found in these high-visibility applications, as well as in products like coffee makers, self-driving cars, GPS tracking devices, and PC accessories. Find out more about the different industries and applications that use low pressure molding compounds:

 

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