LOCTITE ECCOBOND UF 3812

fitur dan keuntungan

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LOCTITE ECCOBOND UF 3812, Halogen-free, Reworkable, Low viscosity, Fast cure, Epoxy, Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3812 reworkable epoxy underfill is designed for CSP, WLCSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
  • Halogen-free
  • Low viscosity material flows at room temperature with no additional preheating required
  • High Tg and high fracture toughness enable excellent protection of solder joints during thermal cycling
  • Room temperature flow capability
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Informasi Teknis

Aplikasi Enkapsulasi, Kurang Pengisian
Jadwal Pengerasan, @ 130.0 °C 10.0 min.
Koefisien Muai Termal (CTE), Above Tg 175.0 ppm/°C
Koefisien Muai Termal (CTE), Below Tg 48.0 ppm/°C
Modulus Penyimpanan, DMA @ 25.0 °C 3-point bending 3004.0 N/mm² (435580.0 psi )
Suhu Penyimpanan -20.0 °C
Suhu Transisi Kaca (Tg) 131.0 °C
Teknologi Epoxy
Tipe Pengeringan Heat Cure
Viskositas, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ 350.0 mPa.s (cP)
Waktu Kerja 1.0 day
Waktu Masa Campur 3.0 day
Warna Hitam