Underfills
One-part epoxy underfill with excellent thermal performance
Reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production. Compatible with most lead-free solders.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
2310026
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- Description
- Technical specification
If you're looking for a halogen-free underfill that shows stable performance under thermal stress, consider LOCTITE® ECCOBOND UF 3812. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. Our ECCOBOND UF 3812 solution can be used with most Pb-free solders; is designed for the production of CSPs, WLCSPs, and BGAs; and is formulated to flow at room temperature with no additional preheating required.
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Halogen-free
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Requires no mixing
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High reworkability
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High glass transition temperature (Tg)
Applications:
Encapsulating,Underfilling
Coefficient of thermal expansion (CTE), Above Tg:
175.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg:
48.0 ppm/°C
Color:
Black
Cure schedule, @ 130.0 °C:
10.0 min.
Cure type:
Heat cure
Glass transition temperature (Tg):
131.0 °C
Pot life:
3.0 day
Storage modulus, DMA, @ 25.0 °C:
3004.0 N/mm² (435580.0 psi)
Storage temperature:
-20.0 °C
Viscosity, Physica, @ 25.0 °C:
350.0 mPa·s (cP)
Work life:
1.0 day
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Large volume or special order?
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