LOCTITE ECCOBOND UF 3810
fitur dan keuntungan
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
- Fast cure at moderate temperatures
- Halogen free
- High Tg
- Compatible with most Pb-free solders
Dokumen dan Unduhan
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Informasi Teknis
| Jadwal Pengerasan, @ 130.0 °C | 8.0 min. |
| Kekentalan, Cone & Plate, @ 25.0 °C Shear Rate 20 s⁻¹ | 394.0 mPa.s (cP) |
| Koefisien Muai Termal (CTE), Above Tg | 171.0 ppm/°C |
| Koefisien Muai Termal (CTE), Below Tg | 55.0 ppm/°C |
| Suhu Transisi Kaca (Tg) | 102.0 °C |
| Waktu Kerja | 3.0 day |
LOCTITE ECCOBOND UF 3810
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill