LOCTITE® ECCOBOND UF 3810

Features and Benefits

LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
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Technical Information

Coefficient of thermal expansion (CTE), Above Tg 171.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 55.0 ppm/°C
Cure schedule, @ 130.0 °C 8.0 min.
Glass transition temperature (Tg) 102.0 °C
Viscosity, cone & plate, @ 25.0 °C Shear Rate 20 s⁻¹ 394.0 mPa·s (cP)
Work life 3.0 day