LOCTITE ECCOBOND FP4526
fitur dan keuntungan
LOCTITE ECCOBOND FP4526, Epoxy, Underfill
LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications.
- Excellent wettability
- Excellent adhesion
- Low viscosity
- Fast flow
Dokumen dan Unduhan
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Informasi Teknis
Jadwal Pengerasan, @ 165.0 °C | 15.0 min. |
Kekentalan, Cone & Plate Brookfield, @ 25.0 °C Spindle 52, speed 10 rpm | 4700.0 mPa.s (cP) |
Koefisien Muai Termal (CTE), Above Tg | 101.0 ppm/°C |
Koefisien Muai Termal (CTE), Below Tg | 33.0 ppm/°C |
Modulus Lendut | 8500.0 N/mm² (1232500.0 psi ) |
Suhu Transisi Kaca (Tg) | 133.0 °C |