LOCTITE® ECCOBOND FP4526
Features and Benefits
LOCTITE ECCOBOND FP4526, Epoxy, Underfill
LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 101.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 33.0 ppm/°C |
| Cure schedule, @ 165.0 °C | 15.0 min. |
| Flexural modulus | 8500.0 N/mm² (1232500.0 psi ) |
| Glass transition temperature (Tg) | 133.0 °C |
| Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 10 rpm | 4700.0 mPa·s (cP) |
LOCTITE® ECCOBOND FP4526
LOCTITE ECCOBOND FP4526, Epoxy, Underfill