LOCTITE ECCOBOND E 1216M

fitur dan keuntungan

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LOCTITE ECCOBOND E 1216M, Epoxy, Underfill
LOCTITE® ECCOBOND E 1216M innovative capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that fully cures in a single reflow cycle, but is stable enough to be easily shipped and used in large volume cartridges (up to 20 oz). It is specifically formulated to eliminate anhydride-type curing agents for those users who prefer to work with anhydride-free products.
  • High Tg
  • Fast, void-free underfill of area array devices
  • Snap curable
  • Excellent stability during shipping, storage and use
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LOCTITE ECCOBOND E 1216M
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Informasi Teknis

Koefisien Muai Termal (CTE), Above Tg 131.0 ppm/°C
Koefisien Muai Termal (CTE), Below Tg 35.0 ppm/°C
Suhu Transisi Kaca (Tg) 125.0 °C
Viskositas, Brookfield, Spindle 4, speed 20 rpm 4000.0 mPa.s (cP)
Waktu Kerja 5.0 day