LOCTITE® ECCOBOND E 1216M

Features and Benefits

Fast-flowing and void-free epoxy underfill with excellent adhesion and strength for high-volume assembly operations.
If you’re looking for an underfill that can handle high-volume assembly operations where fast-flow filling is required, LOCTITE® ECCOBOND E 1216M™ is a great pick. Our ECCOBOND E 1216M™ composite cures entirely in a single reflow cycle but is stable enough to be easily shipped and used in large-volume cartridges (up to 20oz). This black, epoxy-based underfill is ideal for those who prefer to work with anhydride-free products, as it’s specifically formulated to eliminate anhydride-type curing agents.
  • Void-free
  • Retains stability during shipping, storage, and use
  • Snap-curing
  • High glass transition temperature (Tg)
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Technical Information

Coefficient of thermal expansion (CTE), Above Tg 131.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 35.0 ppm/°C
Glass transition temperature (Tg) 125.0 °C
Viscosity, Brookfield, Spindle 4, speed 20 rpm 4000.0 mPa·s (cP)
Work life 5.0 day