LOCTITE ECCOBOND E 1172 A
fitur dan keuntungan
LOCTITE ECCOBOND E 1172 A is a single component underfill for use with very fine area array devices where SMT transparent processing is critical.
LOCTITE® ECCOBOND E 1172 A is an epoxy based, single component underfill that provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.This product cures fast at low temperatures and exhibits low CTE with long pot life.
- Low cure temperature
- For use with very fine area array devices with 25 μm geometries where transparent processing is critical
- Minimizes induced stress at the solder joint to improve thermal cycling performance
- Fast cure at low temperatures
Dokumen dan Unduhan
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Informasi Teknis
| Jadwal Pengerasan, @ 135.0 °C | 6.0 min. |
| Suhu Transisi Kaca (Tg) | 135.0 °C |
| Viskositas, Brookfield, Spindle 3, speed 5 rpm | 17000.0 mPa.s (cP) |
LOCTITE ECCOBOND E 1172 A
LOCTITE ECCOBOND E 1172 A is a single component underfill for use with very fine area array devices where SMT transparent processing is critical.