Underfills
One-part, void-free underfill for very fine area array devices
One-part, epoxy-based underfill encapsulant for use on flip-chip devices with as small as 25 μm geometries.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
When you want an underfill designed for use on very fine area array devices where SMT transparent processing is critical, LOCTITE® ECCOBOND E 1172 A is an excellent choice. This void-free, epoxy-based underfill encapsulant can be used on flip-chip devices with as small as 25-micron geometries. When applied, LOCTITE® ECCOBOND E 1172 A provides a uniform encapsulation with a strong adhesive force, maximizing the device's temperature cycling capability by distributing stress away from solder connects.
Cure schedule, @ 135.0 °C:
6.0 min.
Glass transition temperature (Tg):
135.0 °C
Viscosity, Brookfield, Spindle 3, speed 5 rpm:
17000.0 mPa·s (cP)