BERGQUIST GAP FILLER TGF 1400SL
Terkenal sebagai Gap Filler 1400SL
fitur dan keuntungan
BERGQUIST GAP FILLER TGF 1400SL is a self-leveling, thermally conductive, silicone based, liquid gap filler for thermal transfer and vibration dampening.
BERGQUIST® GAP FILLER TGF 1400SL is a two component, silicone based, thermally conductive liquid gap filler. Low viscosity of the material enables self leveling and filling of unique and intricate gaps resulting in excellent thermal transfer and vibration dampening. This product can be used with infinite thickness variations and for fragile assemblies with less or no stress to the components. It is curable at room temperature, however, the cure rate can also be accelerated with application of heat.
- Self-Leveling
- Thermal Conductivity: 1.4 W/m-K
- Vibration Dampening
- Very Soft
Dokumen dan Unduhan
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Informasi Teknis
Konduktivitas Termal | 1.4 W/mK |
Suhu Operasi | -60.0 - 200.0 °C |
Teknologi | Silikon |
Tingkat Nyala Api | V-0 |
Tipe Pengeringan | Heat Cure |
Resin | |
Warna, Resin | Kuning |
Campuran | |
Warna, Campuran | Kuning |
Pengeras | |
Warna, Pengeras | Putih |