BERGQUIST GAP FILLER TGF 1000

Terkenal sebagai Gap Filler 1000

fitur dan keuntungan

BERGQUIST GAP FILLER TGF 1000 is a silicone based, thermally conductive and form in place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
  • Thermal conductivity: 1.0 W/m-K
  • Ultra-conforming, designed for fragile and low-stress applications
  • Ambient and accelerated cure schedules
  • 100% Solids – no cure by-products
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Informasi Teknis

Jadwal Pengerasan, @ 100.0 °C 5.0 min.
Jadwal Pengerasan, @ 25.0 °C 60.0 - 120.0 min.
Kapasitas Panas, ASTM E1269 1.0 J/g-K
Kekerasan Shore, Thirty second delay value, ASTM D2240 Shore 00 30.0
Konduktivitas Termal 1.0 W/mK
Konstanta Dielektrik, @ 1kHz 5.0
Massa Jenis 1.6 g/cm³
Rasio Campuran, menurut Berat 1 : 1
Rasio Campuran, menurut Volume 1 : 1
Resistivitas Volume 1×10 Ohm m
Suhu Penyimpanan 25.0 °C
Tingkat Nyala Api V-0
Umur Simpan 6.0 mon.
Waktu Masa Campur, @ 25.0 °C 15.0 min.
Resin
Warna, Resin Abu-abu
Pengeras
Warna, Pengeras Putih

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