LOCTITE ABLESTIK 5025E
fitur dan keuntungan
LOCTITE ABLESTIK 5025E is a silver, epoxy film adhesive that is particularly suited for bonding “hot” devices onto heat sinks in applications where electrical insulation is not required.
LOCTITE® ABLESTIK 5025E is a silver filled, thin material that offers uniform bondline control and excellent thermal and electrical conductivity. Typically used for microwave circuitry and heat sink attach applications. This product provides RF/EMI shielding and passes NASA outgassing standards as well as meets MIL-STD-883, Method 5011 requirements.
- Thin, uniform bondline control
- Silver-filled
- RF/EMI shielding
- Electrically conductive in x,y, and z axes
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
| Formulir Fisik | Film |
| Jadwal Pengerasan, @ 150.0 °C | 30.0 min. |
| Kekuatan Geser, Aluminum | 2000.0 psi |
| Konduktivitas Termal | 6.5 W/mK |
| Persetujuan Lembaga/ Spesifikasi | MIL Standard 883, Method 5011 |
| Suhu Transisi Kaca (Tg) | 90.0 °C |
| Teknologi | Epoxy |
| Tipe Pengeringan | Heat Cure |
Pertanyaan Umum
Can the assembly film be cut to my custom design?
What is the best method to cut preforms?
How is assembly film cured?
What are the options to apply pressure during cure?
Do I need to have a clean substrate surface prior to adhesive assembly?
LOCTITE ABLESTIK 5025E
LOCTITE ABLESTIK 5025E is a silver, epoxy film adhesive that is particularly suited for bonding “hot” devices onto heat sinks in applications where electrical insulation is not required.