Henkel Adhesive Technologies

Henkel Adhesive Technologies

Film adhesives

LOCTITE® ABLESTIK 5025E

Film adhesive ideal for microwave circuitry and heat sink attach applications

This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.

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Information

For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver-filled electrically conductive thin-film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements.

Agency approvals / certificates / specifications:

MIL standard 883, method 5011

Cure schedule, @ 150.0 °C:

30.0 min.

Cure type:

Heat cure

Glass transition temperature (Tg):

90.0 °C

Physical form:

Film

Shear strength, Aluminum:

2000.0 psi

Thermal conductivity:

6.5 W/mK

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