LOCTITE ECCOBOND FP4460
fitur dan keuntungan
LOCTITE ECCOBOND FP4460, Epoxy, Encapsulant - glob top
LOCTITE® ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type.
- Low stress
- High purity
- Improved work life
- High temperature performance
Dokumen dan Unduhan
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Informasi Teknis
| Berat Jenis, @ 25.0 °C | 1.78 |
| Jadwal Pengerasan, @ 150.0 °C | 3.0 hr. |
| Koefisien Muai Termal (CTE), Below Tg | 20.0 ppm/°C |
| Suhu Operasi | -65.0 - 150.0 °C |
| Suhu Transisi Kaca (Tg) | 173.0 °C |
| Tipe Pengeringan | Heat Cure |
| Viskositas, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm | 300000.0 mPa.s (cP) |
| Warna | Hitam |
LOCTITE ECCOBOND FP4460
LOCTITE ECCOBOND FP4460, Epoxy, Encapsulant - glob top