LOCTITE® ECCOBOND FP4460

Features and Benefits

LOCTITE ECCOBOND FP4460, Epoxy, Encapsulant - glob top
LOCTITE® ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type.
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Technical Information

Coefficient of thermal expansion (CTE), Below Tg 20.0 ppm/°C
Colour Black
Cure schedule, @ 150.0 °C 3.0 hr.
Cure type Heat Cure
Glass transition temperature (Tg) 173.0 °C
Operating temperature -65.0 - 150.0 °C
Specific gravity, @ 25.0 °C 1.78
Viscosity, Brookfield - RVF, @ 25.0 °C Spindle 7, speed 10 rpm 300000.0 mPa·s (cP)