LOCTITE ECCOBOND E 3230
fitur dan keuntungan
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant
LOCTITE® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices.
- Sag resistant paste
- Fast and low temperature cure
- Resilient
- Long pot life
Dokumen dan Unduhan
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Informasi Teknis
| Casson Viskositas, @ 25.0 °C Shear Rate 10 s⁻¹ | 45200.0 mPa.s (cP) |
| Indeks Tiksotropik | 1.6 |
| Jadwal Pengerasan, @ 100.0 °C | 20.0 min. |
| Suhu Penyimpanan | -20.0 °C |
| Suhu Transisi Kaca (Tg) | 58.0 °C |
| Tipe Pengeringan | Heat Cure |
LOCTITE ECCOBOND E 3230
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant