LOCTITE ABLESTIK ABP 8066T

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LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8066T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. The material is hydrophobic and stable at high temperatures. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
  • High thermal conductivity
  • High electrical conductivity
  • High die shear strength
  • Long open time
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Teknis Lembar Data
LOCTITE ABLESTIK ABP 8066T
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Informasi Teknis

Aplikasi Pelekat Die
Indeks Tiksotropik 6.0
Koefisien Muai Termal (CTE) 53.0 ppm/°C
Koefisien Muai Termal (CTE), Above Tg 90.0 ppm/°C
Konduktivitas Termal 15.0 W/mK
Suhu Transisi Kaca (Tg) 67.0 °C
Tipe Pengeringan Heat Cure
Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm 10000.0 mPa.s (cP)