LOCTITE® ABLESTIK ABP 8066T
Features and Benefits
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive
LOCTITE® ABLESTIK ABP 8066T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. The material is hydrophobic and stable at high temperatures. It is formulated to provide high heat transfer generated by power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 53.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 90.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 67.0 °C |
| Thermal conductivity | 15.0 W/mK |
| Thixotropic index | 6.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 10000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 8066T
LOCTITE ABLESTIK ABP 8066T, Hybrid chemistry, Die Attach, Highly filled, Conductive Adhesive