LOCTITE ABLESTIK ABP 2288A

fitur dan keuntungan

LOCTITE ABLESTIK ABP 2288A, Proprietary Hybrid Chemistry, Die Attach, Sintering Silver Paste
LOCTITE® ABLESTIK ABP 2288A die attach adhesive is designed for use in leadframe applications
  • Low cost
  • Use for wide range of package sizes
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Informasi Teknis

Aplikasi Pelekat Die
Indeks Tiksotropik 4.4
Koefisien Muai Termal (CTE) 80.0 ppm/°C
Koefisien Muai Termal (CTE), Above Tg 170.0 ppm/°C
Konduktivitas Termal 0.6 W/mK
Suhu Transisi Kaca (Tg) 13.0 °C
Tipe Pengeringan Heat Cure
Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm 8500.0 mPa.s (cP)