LOCTITE ABLESTIK 958-8C
fitur dan keuntungan
LOCTITE ABLESTIK 958-8C, Epoxy, Die Attach
LOCTITE® ABLESTIK 958-8C is designed for solder replacement in microelectronic interconnect applications. This adhesive may be used with thick film metalizations or traditional printed circuit board surfaces
- Electrically conductive
- Stress absorbing
- Pb-free alternative to solder
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Pelekat Die |
| Indeks Tiksotropik | 4.1 |
| Jadwal Pengerasan, @ 150.0 °C | 30.0 min. |
| Kekentalan, Cone & Plate, @ 25.0 °C | 22000.0 mPa.s (cP) |
| Kekuatan Geser, Aluminum | 2150.0 psi |
| Nomor Komponen | 1 Part |
| Resistivitas Volume | 0.005 Ohm cm |
| Suhu Penyimpanan | -40.0 °C |
| Teknologi | Epoxy |
| Tipe Pengeringan | Heat Cure |
LOCTITE ABLESTIK 958-8C
LOCTITE ABLESTIK 958-8C, Epoxy, Die Attach