LOCTITE ABLESTIK 3290P
fitur dan keuntungan
LOCTITE ABLESTIK 3290P, Epoxy, Die Attach
LOCTITE® ABLESTIK 3290P electrically conductive die attach adhesive is designed for high reliability package applications. This material is the higher modulus version of 3290 adhesive.
- Medium modulus
- Snap curable
- Low outgassing
- Conductive
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Pelekat Die |
| Indeks Tiksotropik | 3.5 |
| Kekentalan, Cone & Plate, @ 25.0 °C Speed 5 rpm | 12000.0 mPa.s (cP) |
| Koefisien Muai Termal (CTE) | 68.0 ppm/°C |
| Koefisien Muai Termal (CTE), Above Tg | 101.0 ppm/°C |
| Suhu Transisi Kaca (Tg) | 136.0 °C |
| Tipe Pengeringan | Heat Cure |
LOCTITE ABLESTIK 3290P
LOCTITE ABLESTIK 3290P, Epoxy, Die Attach