LOCTITE® ABLESTIK 3290P

Features and Benefits

LOCTITE ABLESTIK 3290P, Epoxy, Die Attach
LOCTITE® ABLESTIK 3290P electrically conductive die attach adhesive is designed for high reliability package applications. This material is the higher modulus version of 3290 adhesive.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 68.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 101.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) 136.0 °C
Thixotropic index 3.5
Viscosity, cone & plate, @ 25.0 °C Speed 5 rpm 12000.0 mPa·s (cP)