LOCTITE ABLESTIK 2030SCM
fitur dan keuntungan
LOCTITE ABLESTIK 2030SCM, Proprietary Hybrid Chemistry, Die attach
LOCTITE® ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.
- Snap curable
- Low stress
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
Aplikasi | Pelekat Die |
Indeks Tiksotropik | 4.6 |
Konduktivitas Termal | 2.3 W/mK |
Tipe Pengeringan | Heat Cure |
Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 14000.0 mPa.s (cP) |