LOCTITE® ABLESTIK 2030SCM
Features and Benefits
LOCTITE ABLESTIK 2030SCM, Proprietary Hybrid Chemistry, Die attach
LOCTITE® ABLESTIK 2030SCM die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.
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Documents and Downloads
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Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Thermal conductivity | 2.3 W/mK |
| Thixotropic index | 4.6 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 14000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 2030SCM
LOCTITE ABLESTIK 2030SCM, Proprietary Hybrid Chemistry, Die attach