LOCTITE ABLESTIK QMI519LB
Terkenal sebagai QMI519LB (20G)
fitur dan keuntungan
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
- Ease of use
- Low resin bleed
- Electrically conductive
- Thermally conductive
Dokumen dan Unduhan
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Informasi Teknis
Aplikasi | Pelekat Die |
Kekuatan Geser Die RT, 2 x 2 mm Si die on Au leadframe | 15.0 kg-f |
Koefisien Muai Termal (CTE) | 40.0 ppm/°C |
Konten Ionik yang Dapat Diekstrak, Kalium (K+) | 19.0 ppm |
Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) | 19.0 ppm |
Konten Ionik yang Dapat Diekstrak, Natrium (Na+) | 19.0 ppm |
Tipe Pengeringan | Heat Cure |