LOCTITE ABLESTIK QMI519LB

Terkenal sebagai QMI519LB (20G)

fitur dan keuntungan

LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
  • Ease of use
  • Low resin bleed
  • Electrically conductive
  • Thermally conductive
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Informasi Teknis

Aplikasi Pelekat Die
Kekuatan Geser Die RT, 2 x 2 mm Si die on Au leadframe 15.0 kg-f
Koefisien Muai Termal (CTE) 40.0 ppm/°C
Konten Ionik yang Dapat Diekstrak, Kalium (K+) 19.0 ppm
Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) 19.0 ppm
Konten Ionik yang Dapat Diekstrak, Natrium (Na+) 19.0 ppm
Tipe Pengeringan Heat Cure