LOCTITE® ABLESTIK QMI519LB

Connu sous le nom de QMI519LB (20G)

Caractéristiques et avantages

LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
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Informations techniques

Applications Soudage de puce
Coefficient de dilatation thermique (CDT) 40.0 ppm/°C
Résistance au cisaillement puce RT, 2 x 2 mm Si die on Au leadframe 15.0 kg-f
Teneur ionique extractible, Chlorure (Cl) 19.0 ppm
Teneur ionique extractible, Potassium (K+) 19.0 ppm
Teneur ionique extractible, Sodium (Na+) 19.0 ppm
Type de polymérisation Polymérisation par la chaleur