LOCTITE ABLESTIK DX20C
Terkenal sebagai ECCOBOND DX-20C 0.03KG
fitur dan keuntungan
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
- One component
- No yellowing
- Excellent adhesion
- Long work life
Dokumen dan Unduhan
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Informasi Teknis
Aplikasi | Pelekat Die |
Indeks Tiksotropik | 4.2 |
Kekentalan, Cone & Plate, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
Kekuatan Geser Die Panas | 5.0 kg-f |
Kekuatan Geser Die RT | 12.8 kg-f |
Kunci Karakteristik | Konduktivitas: Tidak Konduktif Elektrik |
Tipe Pengeringan | Heat Cure |