LOCTITE® ABLESTIK DX20C
Known as ECCOBOND DX-20C 0.03KG
Features and Benefits
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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Documents and Downloads
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Technical Information
| Applications | Die Attach |
| Cure type | Heat Cure |
| Hot die shear strength | 5.0 kg-f |
| Key characteristics | Conductivity: Electrically Non-Conductive |
| RT die shear strength | 12.8 kg-f |
| Thixotropic index | 4.2 |
| Viscosity, cone & plate, @ 25.0 °C Speed 10 rpm | 12000.0 mPa·s (cP) |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.