LOCTITE ABLESTIK ABP 2036SF
fitur dan keuntungan
LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste
LOCTITE® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination and overall improvement in package reliability
- Non-conductive
- Halogen free
- Snap curable
- Low cure temperature
Dokumen dan Unduhan
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Informasi Teknis
| Aplikasi | Pelekat Die |
| Formulir Fisik | Pasta |
| Indeks Tiksotropik | 4.42 |
| Jenis Filler | Silika |
| Kekuatan Geser Die Panas, @ 150.0 °C 2 x 2 mm Si die on PPF leadframe | 1.6 kg-f |
| Kekuatan Geser Die RT, 2 x 2 mm Si die on PPF leadframe | 12.0 kg-f |
| Konduktivitas Termal | 0.35 W/mK |
| Kunci Karakteristik | Konduktivitas: Tidak Konduktif Elektrik, Kecepatan Kering : Cepat Kering, Stres: Stres rendah |
| Metode Aplikasi | Sistem dosis |
| Modulus Tensil, @ 250.0 °C | 55.0 N/mm² (8180.0 psi ) |
| Nomor Komponen | 1 Part |
| Substrat | LeadFrame: Emas |
| Suhu Transisi Kaca (Tg) | 125.0 °C |
| Teknologi | Hybrid Chemistry |
| Tipe Pengeringan | Heat Cure |
| Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 12760.0 mPa.s (cP) |
| Warna | Merah |
LOCTITE ABLESTIK ABP 2036SF
LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste